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Three-dimensional integrated circuit
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11	Microsoft Word - RS LetiERC.docx Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2014-11-06 02:04:42 Integrated circuits Semiconductor devices Electronic design Microtechnology Semiconductor device fabrication Silicon-germanium Three-dimensional integrated circuit MOSFET Mixed-signal integrated circuit Electronic engineering Electronics Technology
12	WORKSHOPS AND SHORT COURSES Add to Reading List Source URL: www.eumweek.com Language: English - Date: 2015-04-22 10:49:33 Integrated circuits Semiconductor device fabrication Multi-chip module Three-dimensional integrated circuit Electronic design Monolithic microwave integrated circuit Electronic packaging Electronic design automation Electronics Electronic engineering Technology
13	Design and Measurement of Matched Wire Bond and Flip Chip Interconnects for D-Band System-in-Package Applications S. Beer, B. Ripka, S. Diebold, H. Gulan, C. Rusch, P. Pahl, T. Zwick Institut fuer Hochfrequenztechnik und Add to Reading List Source URL: www.success-project.eu Language: English - Date: 2011-11-02 05:29:30 Semiconductor device fabrication Integrated circuits Wire bonding Flip chip Antenna Transmission line Microwave System in package Three-dimensional integrated circuit Electronic engineering Technology Electronics
14	WELCOME FROM THE MAYOR OF SAN DIEGO 2 WELCOME FROM ECTC GENERAL AND PROGRAM CHAIRS On behalf of the Program Committee and Executive Committee, it is our pleasure to welcome you to the 65th Electronic Add to Reading List Source URL: www.ectc.net Language: English - Date: 2015-05-12 23:46:05 Semiconductor device fabrication Three-dimensional integrated circuit
15	Graduate Seminar Design for Manufacturability and Reliability in Extreme Scaling and Beyond ECE Seminar Committee Add to Reading List Source URL: www.ece.cmu.edu Language: English - Date: 2015-01-31 02:10:36 Design Telecommunications engineering Very-large-scale integration Three-dimensional integrated circuit International Conference on Computer-Aided Design Design for manufacturability International Symposium on Physical Design Multiple patterning Electric Electronic engineering Electronics Integrated circuits
16	FOR IMMEDIATE RELEASE FOWLP is now entering a new era …SPTS Technologies, an Orbotech company, interviewed by Yole Développement’s analysts LYON, France –May 6, 2015 – Fan-Out Wafer Level Packaging is now enteri Add to Reading List Source URL: www.yole.fr Language: English - Date: 2015-05-06 04:31:30 Technology Orbotech Microelectromechanical systems Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Wafer TSMC Semiconductor fabrication plant Semiconductor device fabrication Materials science Microtechnology
17	Esec 2100 FC plus Driving Innovation Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-02 02:31:34 Microtechnology Semiconductor device fabrication Three-dimensional integrated circuit Flip chip Integrated circuits Electronics Electronic engineering
18	Microsoft Word - RS LetiERC.docx Add to Reading List Source URL: www.leti.fr Language: English - Date: 2014-11-06 02:04:42 Integrated circuits Semiconductor devices Electronic design Microtechnology Semiconductor device fabrication Silicon-germanium Three-dimensional integrated circuit MOSFET Mixed-signal integrated circuit Electronic engineering Electronics Technology
19	Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:02:53 Integrated circuits Semiconductor devices Electronics manufacturing Electrical engineering Semiconductor device fabrication Quad-flat no-leads package Printed circuit board Three-dimensional integrated circuit Flip chip Electronics Electromagnetism Electronic engineering
20	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology